Belden
80
NA
ATMEL
8890
QFN28
MICROCHIP/微芯
95000
开发板
ST
16900
BGA
EOREX
10000
TSOP
2084
EOREX
20105
TSOP
STM
3200
LFBGA
CapXon(丰宾)
7350
SMD,6.3x5.5mm
TE Connectivity Aerospace, Def
436
原厂封装
只做原装
36520
BGA
CAPXON-丰宾
96500
DIP-2.直插
BUSSMANN
96800
车规-被动器件
KEMET-基美
143788
车规-电容器