ST
16900
BGA
STM
3200
LFBGA
BUSSMANN
1000
MODULE
EOREX
20105
TSOP
RENESAS
27968
BGA
TE Connectivity Aerospace, Def
436
原厂封装
BUSSMANN
96800
车规-被动器件
KEMET-基美
143788
车规-电容器
CAPXON-丰宾
96500
DIP-2.直插
EOREX
1000
TSOP
Microchip
44520
原封装
2084
EOREX
10000
TSOP
ATMEL
17300
QFN28