CapXon(丰宾)
7350
SMD,6.3x5.5mm
MICROCHIP/微芯
95000
开发板
EOREX
20105
TSOP
STM
3200
LFBGA
RENESAS
27968
BGA
TE Connectivity Aerospace, Def
436
原厂封装
SANYO
2650
BGA
BUSSMANN
96800
车规-被动器件
CAPXON-丰宾
96500
DIP-2.直插
KEMET-基美
143788
车规-电容器
EOREX
1000
TSOP
2084
ST
16900
BGA
ST
16900
BGA