Features:
• Glass passivated junction chip
• For surface mounted application
• Low profile package
• Built-in strain relief
• Ideal for automated placement
• Easy pick and place
• Super fast recovery time for high efficiency
• Glass passivated chip junction
• High temperature soldering: 260°C/10 seconds at terminals
• Plastic material
ES3H
扬杰
10000
SMC
TaiwanSemiconductor
3000
NA
TSC-台半
9328
DO-214
TSC-台半
36218
DO-214
ES3H
TSC
5000
原厂正规渠道
YANGJIE
50000
SMC
67000
N/A
TAIWAN
6675
DO-214
TAIWAN
3675
DO-214
ES3H
TSC
5000
原厂正规渠道
ES3H
YANGJIE
50000
SMC
ES3H
63000
N/A