MOLEX3
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 8 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
MOLEX3
2.54mm (.100) Pitch C-Grid Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 10 Circuits
MOLEX3
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 12 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
MOLEX3
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 14 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
MOLEX3
2.54mm (.100) Pitch C-Grid Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 16 Circuits
MOLEX3
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 18 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
MOLEX3
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 22 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
DALLAS
8000
BGA
22+
原装正品支持实单
MAXIM/美信
12820
NA
21+
只做原装,质量保证
DALLAS
9896
BGA
23+
DALLAS
64
WBGA
24+
DALLAS
256800
BGA
19+
原厂代理渠道,每一颗芯片都可追溯原厂;