1.1 Features 1

• Architecture designed for infotainment applications

• Video, image, and graphics processing support

– Full-HD video (1920 × 1080p, 60 fps)

– Multiple video input and video output

– 2D and 3D graphics

• Dual Arm® Cortex®-A15 microprocessor subsystem

• Up to two C66x floating-point VLIW DSP

– Fully object-code compatible with C67x and C64x+

– Up to thirty-two 16 x 16-Bit fixed-point multiplies per cycle

• Up to 2.5MB of on-chip L3 RAM

• Level 3 (L3) and level 4 (L4) interconnects

• Two DDR2/DDR3/DDR3L memory interface (EMIF) modules

– Supports up to DDR2-800 and DDR3-1066

– Up to 2GB supported per EMIF

• Dual Arm® Cortex®-M4 Image Processing Units (IPU)

• Up to two Embedded Vision Engines (EVEs)

• IVA subsystem

• Display subsystem

– Display controller with DMA engine and up to three pipelines

– HDMI™ encoder: HDMI 1.4a and DVI 1.0 compliant

• Video Processing Engine (VPE)

• 2D-graphics accelerator (BB2D) subsystem

– Vivante® GC320 core

• Dual-core PowerVR® SGX544 3D GPU

• Three Video Input Port (VIP) modules

– Support for up to 10 multiplexed input ports

• General-Purpose Memory Controller (GPMC)

• Enhanced Direct Memory Access (EDMA) controller

• 2-port gigabit ethernet (GMAC)

• Sixteen 32-Bit general-purpose timers

• 32-Bit MPU watchdog timer

• Five Inter-Integrated Circuit ( I2C™) ports

• HDQ™/ 1-Wire® interface

• SATA interface

• MediaLB® (MLB) subsystem

• Ten configurable UART/IrDA/CIR modules

• Four Multichannel Serial Peripheral Interfaces (McSPI)

• Quad SPI (QSPI)

• Eight Multichannel Audio Serial Port (McASP) modules

• SuperSpeed USB 3.0 dual-role device

• Three high-speed USB 2.0 dual-role devices

• Four Multimedia Card/Secure Digital/Secure Digital Input Output interfaces ( MMC™/ SD®/SDIO)

• PCI-Express® 3.0 subsystems with two 5-Gbps lanes

– One 2-lane gen2-compliant port

– or Two 1-lane gen2-compliant ports

• Dual Controller Area Network (DCAN) modules

– CAN 2.0B protocol

• Up to 247 General-Purpose I/O (GPIO) pins

• Real-Time Clock SubSystem (RTCSS)

• Device security features

– Hardware crypto accelerators and DMA

– Firewalls

– JTAG® lock

– Secure keys

– Secure ROM and boot

• Power, Reset, and Clock Management (PRCM)

• On-chip debug with CTools technology

• 28-nm CMOS technology

• 23 mm × 23 mm, 0.8-mm pitch, 760-pin BGA (ABC)