Intel
Dual-Core Intel Xeon Processor
TEC
泰科电子有限公司
Crimping Die Assemblies and Supports for COPALUM Lite Sealed Terminals and Splices
MACOM
This instruction sheet covers the application and maintenance procedures for Pneumatic Crimping Head Assembly
MACOM
This instruction sheet covers the application and maintenance procedures for Pneumatic Crimping Head Assembly
MOLEX7
1.60mm (.063) Pitch Board-to-Board Panel Detachable, PCB Receptacles, RightAngle, 8 Circuits, Gold (Au) Selective Plating, with Beveled Metal Pins, Tray PackagingLead-free,
MOLEX7
0.50mm (.020) Pitch SlimStack??Receptacle, Surface Mount, Dual Row, Vertical,2.50mm (.098) Stacking Height, Gold Plating with Nickel Barrier, 16 Circuits
MOLEX7
0.50mm (.020) Pitch SlimStack??Receptacle, Surface Mount, Dual Row, Vertical2.50mm (.098) Stacking Height, Gold Plating with Nickel Barrier, 20 Circuits
MOLEX7
0.50mm (.020) Pitch SlimStack??Receptacle, Surface Mount, Dual Row, Vertical2.50mm (.098) Stacking Height, Gold Plating with Nickel Barrier, 30 Circuits
MOLEX7
0.50mm (.020) Pitch SlimStack??Receptacle, Surface Mount, Dual Row, Vertical,2.50mm (.098) Stacking Height, Gold Plating with Nickel Barrier, 40 Circuits
MOLEX7
0.50mm (.020) Pitch SlimStack??Receptacle, Surface Mount, Dual Row, Vertical2.50mm (.098) Stacking Height, Gold Plating with Nickel Barrier, 50 Circuits
MOLEX7
0.50mm (.020) Pitch SlimStack??Receptacle, Surface Mount, Dual Row, Vertical2.50mm (.098) Stacking Height, Gold Plating with Nickel Barrier, 60 Circuits
MOLEX7
0.50mm (.020) Pitch SlimStack??Receptacle, Surface Mount, Dual Row, Vertical,2.50mm (.098) Stacking Height, Gold Plating with Nickel Barrier, 70 Circuits
MOLEX7
0.50mm (.020) Pitch SlimStack??Receptacle, Surface Mount, Dual Row, Vertical 2.50mm (.098) Stacking Height, Gold Plating with Nickel Barrier, 40 Circuits
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DL-3149-054
SANYO/三洋
28533
CAN3
23+
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TI
2705
TSSOP
25+
原装正品,假一罚十!
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电话：0755-82721010
手机：18923718265
QQ：
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LED发光管
240000
SMD
23+
原厂授权一级代理,专业海外优势订货,价格优势、品种
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Donepower
5000
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DISPLAY
2000
BGA
一级代理 原装正品假一罚十价格优势长期供货
