TI
4500
BGA
SCRAP
9200
SOT-153SOT-23-5
ADI/亚德诺
26800
BGA
SAMSUNG
20000
BGA
AMD
8324
FCBGA
ADI/亚德诺
66900
原封装
SAMSUNG
8000
QFN
TECATE INDUSTRIES
3441832
N/A
76000
N/A
HITACHI/日立
180000
SMD
SAMSUNG
2300
BGA
CMD
3750
SOT5
SUPCON MICROELECTRONICS(中控微
13
LQFP-144(20x20)
SAMSUNG
50
BGA121
CUIDEVICES
12820
NA