ADI
80000
BGA
AMD
13
BGA
ADI
1443
BGA
SAMSUNG
24000
WLCSP36
KEMET
5000
SMD
SUPCON MICROELECTRONICS(中控微
6000
QFN64EP(8x8)
AMD
50000
BGA
CUI
50000
DIP2
TE
518000
NA
AMD
13
BGA
ADI/亚德诺
66900
AMD
6000
BGA
SUPCON MICROELECTRONICS(中控微
9980
LQFP-144
ADI/亚德诺
13880
原封装
CUI
10000