SAMSUNG
24000
WLCSP36
CUI
10000
CUIDEVICES
10000
NA
SAMSUNG/三星
6500
BGA
AD
6860
BGA
SUPCON MICROELECTRONICS(中控微
9980
LQFP-144
78300
N/A
ADI
8560
BGA
ADI/亚德诺
13880
原封装
CUI
46200
ADI/亚德诺
66900
MTK
5280
BGA
SUPCON MICROELECTRONICS(中控微
514
LQFP144
SUPCON MICROELECTRONICS(中控微
60
LQFP-144(20x20)
ADI
20000