SAMSUNG
20000
BGA
SUPCON MICROELECTRONICS(中控微
514
LQFP144
ADI/亚德诺
66900
原封装
CUIDEVICES
12820
NA
CUIDEVICES
12245
N/A
CMD
9850
SOT5
CUI
10000
con
73000
N/A
ADI/亚德诺
26800
BGA
20000
DIP28
SAMSUNG/三星
4727
QFN
SAMSUNG/三星
100500
BGA
SAMSUNG
5000
BGA
KEMET
12800
SMD