SAMSUNG
18000
标准封装
SAMSUNG
20000
BGA
SUPCON MICROELECTRONICS(中控微
6000
QFN64EP(8x8)
AMD
6528
BGA
AMD
3752
BGA
TECATE INDUSTRIES
518000
SMD
TI/德州仪器
6852
BGA
SAMSUNG
6000
BGA
AMD
6000
BGA
AMD
6
BGA
Connphy Microwave
400
模块
Connphy Microwave
400
模块
Connphy Microwave
400
模块
Connphy Microwave
400
模块
AMD
50000
BGA