CL0480-0878-0-95
HIROSE
日本广濑电机株式会社
0.3mm Pitch, 0.5mm Stacking Height, Fully Armored, Hybrid FPC-to-Board Connector
MOLEX10
2.54mm (.100 Header, Through Hole, Breakaway, Vertical, 28 Circuits 2.50關m (100關 Tape on Reel Packaging, Lead-free
MOLEX10
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Lead- free 12 Circuits, 0.76關m
MOLEX10
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, Lead-free, 48 Circuits, 0.38關m (15關) Gold (Au) Plating, Center Polarization Slot, with Locking
MOLEX10
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Fully Shrouded, Lead-free, 34 Circuits, Gold (Au) Flash Plating, without PCB Locator, without Locking Window
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 20 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window
MOLEX10
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 24 Circuits, 0.38關m (15關) Gold (Au) Plating, Pick-and-Place Cap
MOLEX10
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, Lead-free, 14 Circuits, 0.38關m (15關) Gold (Au) Plating, Center Polarization Slot,
MOLEX10
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Shrouded, Lead-free, 10 Circuits, 0.38關m (15關) Gold (Au) Plating, without PCB Locator, with Locking Window
MOLEX10
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, 4 Circuits, 0.38關m (15關) Gold (Au) Plating, with Center Locking Window, Tube, Lead-free
SAMSUNG(三星)
7350
0402
24+
现货供应,当天可交货!免费送样,原厂技术支持!!!
SAMSUNG/三星
16854648
SMD
2025+
代理销售SAMSUNG/三星原装现货
SAMSUNG/三星
880000
ROHS
25+
明嘉莱只做原装正品现货
SAMSUNG
880000
SMD
23+
明嘉莱只做原装正品现货
SAMSUNG/三星
880000
0402
24+
明嘉莱只做原装正品现货