FEATURES
All contacts are non-shorting
BBM (break before make)
30°, 60° or 90° switch indexing
8-disc lock – anti-pick
Single wafer switch
Up to 4 poles per switch
Solder or PCB terminals
Gold flashed or gold
plated also available
2 keys per switch as standard
Key removeable at 30° 60° or 90°
Common or differ keys
2000 combinations
Master key system available
Two stage assembly: Lock
through front and the module
attaches by bracket from the
inside
Max panel thickness 3.0mm
LEM
10000
MODULE
TI/德州仪器
9850
TSSOP24
LEM
10000
TI
3629
TSOP24
46000
N/A
LEMUSAINC
100500
SMD
N/A
80000
SOLDERWIRE63/37T/COREP20
25
TI
168
TSSOP24
C
5000
SMD
LEM
65200
ILME
40
-
TI
3720
TSSOP
MURATA
6020
KYOCERA
3000
SMD
CL05B104KB54PNC(三星电机 SAMSUNG) 89000000PCS
发布时间:2026-06-23CL10A105KB8NNNC(三星电机 SAMSUNG) 8900000000PCS
发布时间:2026-06-23