Features and benefits
* High collector current capability IC and
ICM
* Three current gain selections
* Reduced Printed-Circuit Board (PCB)
area requirements
* Leadless very small SMD plastic
package with medium power capability
* Exposed heat sink for excellent thermal
and electrical conductivity
* Suitable for Automatic Optical
Inspection (AOI) of solder joint
* AEC-Q101 qualified
Nexperia(安世)
3022
DFN-3(2x2)
NEXPERIA/安世
600000
SOT1061D
Nexperia(安世)
21000
DFN-3(2x2)
Nexperia(安世)
21000
DFN-3(2x2)
Nexperia
100000
Modules
NEXPERIA/安世
65258
原厂原封可拆样
NEXPERIA/安世
60000
SOT1061D
NEXPERIA
15062
芯为深圳现货
恩XP
236148
DFN-3.贴片
BC56PAS
恩XP
18000
DFN-3(2x2)
BC56PAS
恩XP
22360
N/A
Nexperia(安世)
115000
DFN2020D-3
BC56PAS
恩XP
22412
N/A
LINEAR/凌特
69820
SOT23-5
NEXPERIA
16750
DFN-3