Features
High reverse bearkdown voltage.
Fast switching speed.
Low reverse leakage current.
Surface mount package ideally suited for automatic insertion.
Galvanically isolated dual configurations to save board space.
Lead free in compliance with EU RoHS 2.0
Green molding compound as per IEC 61249 standard
恩XP
29128
SOD323
DIODES/美台
8850
SOD123
恩XP
8850
SOD-123
NEXPERIA/安世
213
*
恩XP
6000
HIROSE/广濑
182881
/
恩XP
236148
SOD-123
恩XP
18800
SOD-123
NEXPERIA/安世
30098
SOD-123F
nexperia
5864
开关二极管
恩XP
8000
N/A
恩XP
86720
BGA
恩XP
80000
SOD323
恩XP
36218
SOD-123
振华工业
20000
SOD-323