FEATURES
• Plastic material used carries Underwriters Laboratory recognition 94V-O
• Low leakage
• Ideal for printed circuit board
• Exceeds environmental standards of MIL-S-19500
• Lead free in compliance with EU RoHS 2.0
MECHANICAL DATA
• Case: Reliable low cost construction utilizing molded plastic technique
results in inexpensive product
• Terminals: Lead solderable per MIL-STD-750, Method 2026
• Polarity: Polarity symbols molded or marking on body
• Weight: 0.0044 ounce, 0.1268 gram
COMCHIP/典琦科技
5000
MBS
COMCHIP/典琦科技
34000
MBS
BISS原装特价出
42041
DIPSOP-16
BISS
3200
DIPSOP-16
SAMPLE
1880
车规-模块MODULE
BISS原装特价出
86720
DIPSOP-16
Comchip
200000
MBS
B1S
PANJIT/强茂
100500
SMD
B1S
LRC/乐山
360000
SOP-4
Comchip
36800
MBS
B1S
PANJIT/强茂
135000
MDI
SAMPLE
5000
MODULE
B1S
60000
N/A
BISS出售
50000
DIPSOP-16
SAMPLE
362
模块