887-076-542-812
EDAC
亚得电子(东莞)有限公司
887 Series High Temp Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
EDAC
亚得电子(东莞)有限公司
887 Series High Temp Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
EDAC
亚得电子(东莞)有限公司
887 Series High Temp Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
EDAC
亚得电子(东莞)有限公司
887 Series High Temp Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
EDAC
亚得电子(东莞)有限公司
887 Series High Temp Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
EDAC
亚得电子(东莞)有限公司
887 Series High Temp Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
EDAC
亚得电子(东莞)有限公司
887 Series High Temp Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
EDAC
亚得电子(东莞)有限公司
887 Series High Temp Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
MOLEX9
MOLEX莫仕公司
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-6 Multi-Port Press Fit Connector without Lightpipe Ports, EMI Metal Gasket, 240 Circuits
MOLEX9
MOLEX莫仕公司
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-2 Multi-Port Connector with 4 Lightpipe Ports, EMI Metal Gasket, 80 Circuits, Tin (Sn)/Lead(Pb) Tails
MOLEX9
MOLEX莫仕公司
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-5 Multi-Port Connector with 2 Inner Lightpipe Ports, Elastomeric Gasket, 200 Circuits, Tin (Sn)/Lead(Pb) Tails
MOLEX9
MOLEX莫仕公司
2.00mm (.079) Pitch VHDM짰 H Board-to-Board Backplane Header, Vertical, 8-Row, Signal Module, Open End Version, 200 Circuits
MOLEX9
MOLEX莫仕公司
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-2 Multi-Port Connector with 2 Outer Lightpipe Ports, EMI Metal Gasket, 80 Circuits, Tin (Sn)/Lead(Pb) Tails
MOLEX9
MOLEX莫仕公司
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-5 Multi-Port Connector with 4 Lightpipe Ports, EMI Metal Gasket, 200 Circuits, Tin (Sn) Tails
MOLEX9
MOLEX莫仕公司
VHDM짰 H-Series Board-to-Board Backplane Header, 2.00mm (.079) Pitch Vertical, 8-Row, Open Signal Module, 80 Circuits, Advance Mate Shield
MOLEX9
MOLEX莫仕公司
2.00mm (.079) Pitch VHDM짰 H Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin, Shield End Module, Open End Version, 80 Circuits, Pin Length 4.75mm(.187), Tin/Lead
MOLEX9
MOLEX莫仕公司
2.00mm (.079) Pitch VHDM짰 H Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin, Signal End Module, Open End Version, 80 Circuits, Pin Length 4.75mm(.187), Lead Free
MOLEX9
MOLEX莫仕公司
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-6 Multi-Port Connector with 2Inner Lightpipe Ports, EMI Metal Gasket, 240 Circuits, Tin (Sn) Tails
N/A
990000
NA
24+
明嘉莱只做原装正品现货
5000
原厂封装
2020+
百分百原装正品 真实公司现货库存 本公司只做原装 可
AMPHENOLICCFCI
6540
NA
23+
只做原装正品现货或者订货假一赔十!
AMPHENOLICCFCI
6540
NA
23+
只做原装正品现货或者订货假一赔十!
AMPHENOLICCFCI
6540
NA
23+
只做原装正品现货或者订货假一赔十!