887-076-542-207
EDAC
亚得电子(东莞)有限公司
887 Series High Temp Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
EDAC
亚得电子(东莞)有限公司
887 Series High Temp Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
EDAC
亚得电子(东莞)有限公司
887 Series High Temp Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
EDAC
亚得电子(东莞)有限公司
887 Series High Temp Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
EDAC
亚得电子(东莞)有限公司
887 Series High Temp Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
EDAC
亚得电子(东莞)有限公司
887 Series High Temp Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
EDAC
亚得电子(东莞)有限公司
887 Series High Temp Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
EDAC
亚得电子(东莞)有限公司
887 Series High Temp Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
MOLEX9
MOLEX莫仕公司
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-6 Multi-Port Press Fit Connector without Lightpipe Ports, EMI Metal Gasket, 240 Circuits
MOLEX9
MOLEX莫仕公司
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-2 Multi-Port Connector with 4 Lightpipe Ports, EMI Metal Gasket, 80 Circuits, Tin (Sn)/Lead(Pb) Tails
MOLEX9
MOLEX莫仕公司
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-5 Multi-Port Connector with 2 Inner Lightpipe Ports, Elastomeric Gasket, 200 Circuits, Tin (Sn)/Lead(Pb) Tails
MOLEX9
MOLEX莫仕公司
2.00mm (.079) Pitch VHDM짰 H Board-to-Board Backplane Header, Vertical, 8-Row, Signal Module, Open End Version, 200 Circuits
MOLEX9
MOLEX莫仕公司
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-2 Multi-Port Connector with 2 Outer Lightpipe Ports, EMI Metal Gasket, 80 Circuits, Tin (Sn)/Lead(Pb) Tails
MOLEX9
MOLEX莫仕公司
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-5 Multi-Port Connector with 4 Lightpipe Ports, EMI Metal Gasket, 200 Circuits, Tin (Sn) Tails
MOLEX9
MOLEX莫仕公司
VHDM짰 H-Series Board-to-Board Backplane Header, 2.00mm (.079) Pitch Vertical, 8-Row, Open Signal Module, 80 Circuits, Advance Mate Shield
MOLEX9
MOLEX莫仕公司
2.00mm (.079) Pitch VHDM짰 H Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin, Shield End Module, Open End Version, 80 Circuits, Pin Length 4.75mm(.187), Tin/Lead
MOLEX9
MOLEX莫仕公司
2.00mm (.079) Pitch VHDM짰 H Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin, Signal End Module, Open End Version, 80 Circuits, Pin Length 4.75mm(.187), Lead Free
MOLEX9
MOLEX莫仕公司
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-6 Multi-Port Connector with 2Inner Lightpipe Ports, EMI Metal Gasket, 240 Circuits, Tin (Sn) Tails
ACES
1042
NA
23+
专做原装正品,假一罚百!
3629
DIP
22+
原装优势!房间现货!欢迎来电!
5632
2016+
只做进口原装正品!现货或者订货一周货期!只要要网上有
NA
25
NA/
23+
优势代理渠道,原装正品,可全系列订货开增值税票
AMP
448402
2308+
一级代理,原装正品,公司现货!