Features
0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing
Accepts .062 (1.57mm) Nominal Thickness P.C. Board
High Profile Insulator Body, .600 (15.24mm)
Card Slot Depth of .330 (8.38mm)
Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bends
Single or Dual Row Configurations
Large Variety of Mounting Options, Flush or Offset Lugs
Accepts between Contact and In-Contact Polarizing Keys
Pre-assembled Card Guides are available
RoHS Compliant, UL Certified
AMPHENOL/安费诺
209858
/
N/A
3000
SOP8
TE CONNECTIVITY
3683
SMD
TE/泰科
34620
TRIQUINT
100500
QFN
3629
DIP
MT
86720
原厂原封装
INTERSIL
9850
DIP8
TRIQUINT
12245
QFN
TE
300000
SMT
INTERSIL
328
SOP8
WEIDMULLER
8796
继电器
5000
INTERSIL
50000
SOP8
AMP
13352
ROHS