87797-0040
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 40 Circuits, 2.54關m (100關) Tin (Sn) Plating, 14.22mm (.560) Stacking Height
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 6 Circuits, 0.76關m (30關) Gold (Au) Plating, 25.60mm (1.043) Stacking Height
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 12 Circuits, 0.76關m (30關) Gold (Au) Plating, 8.00mm (.315) Stacking Height
MOLEX10
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 18 Circuits, Gold (Au) Flash Plating, 9.35mm (.368) Stacking Height, Tray Packaging
TE Connectivity
10000
端子
2301+
全新、原装
MOLEX
3200
DIP
25+
全新原装、诚信经营、公司现货销售
32000
24+
全新原厂原装正品现货,低价出售,实单可谈
803
24+
MOLEX/莫仕
182881
/
2508+
一级代理,原装现货