845-076-521-808
EDAC
亚得电子(东莞)有限公司
845 Series High Temp Card Edge Connector | Green | 0.100 (2.54mm) Pitch | 0.200 (5.08mm) Row Spacing
845-076-521-808
EDAC
亚得电子(东莞)有限公司
845 Series High Temp Card Edge Connector | Green | 0.100 (2.54mm) Pitch | 0.200 (5.08mm) Row Spacing
MOLEX9
MOLEX莫仕公司
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-6 Multi-Port Press Fit Connector without Lightpipe Ports, EMI Metal Gasket, 240 Circuits
MOLEX9
MOLEX莫仕公司
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-2 Multi-Port Connector with 4 Lightpipe Ports, EMI Metal Gasket, 80 Circuits, Tin (Sn)/Lead(Pb) Tails
MOLEX9
MOLEX莫仕公司
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-5 Multi-Port Connector with 2 Inner Lightpipe Ports, Elastomeric Gasket, 200 Circuits, Tin (Sn)/Lead(Pb) Tails
MOLEX9
MOLEX莫仕公司
2.00mm (.079) Pitch VHDM짰 H Board-to-Board Backplane Header, Vertical, 8-Row, Signal Module, Open End Version, 200 Circuits
MOLEX9
MOLEX莫仕公司
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-2 Multi-Port Connector with 2 Outer Lightpipe Ports, EMI Metal Gasket, 80 Circuits, Tin (Sn)/Lead(Pb) Tails
MOLEX9
MOLEX莫仕公司
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-5 Multi-Port Connector with 4 Lightpipe Ports, EMI Metal Gasket, 200 Circuits, Tin (Sn) Tails
MOLEX9
MOLEX莫仕公司
VHDM짰 H-Series Board-to-Board Backplane Header, 2.00mm (.079) Pitch Vertical, 8-Row, Open Signal Module, 80 Circuits, Advance Mate Shield
MOLEX9
MOLEX莫仕公司
2.00mm (.079) Pitch VHDM짰 H Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin, Shield End Module, Open End Version, 80 Circuits, Pin Length 4.75mm(.187), Tin/Lead
MOLEX9
MOLEX莫仕公司
2.00mm (.079) Pitch VHDM짰 H Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin, Signal End Module, Open End Version, 80 Circuits, Pin Length 4.75mm(.187), Lead Free
HIFN
80000
BGA
2020+
只做自己库存,全新原装进口正品假一赔百,可开13%增
FCI
662
SMD
15+
一级代理,专注军工、汽车、医疗、工业、新能源、电力
FCI
6000
CONN
21+
全新原装 现货 价优
EXAR/艾科嘉
860000
BGA
24+
明嘉莱只做原装正品现货
FCI
990000
CONN
24+
明嘉莱只做原装正品现货