Features
.100 (2.54mm) Contact Spacing x .200 (5.08mm) Row Spacing
Accepts .062 (1.57mm) Nominal Thickness P.C. Board
High Profile Insulator Body, .600 (15.24mm)
Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bends
Single or Dual Row Configurations
Large Variety of Mounting Options, Flush or Offset Lugs
Accepts between contact and In-Contact Polarizing Keys
Pre-assembled Card Guides are available
Automatic Wire Wrap Positioning Holes
RoHS Compliant, UL Certified
MOLEX/莫仕
343380
/
MOLEX ELECTRONICS
122249
SMD
MOLEX
2963
连接器
MOLEX/莫仕
9850
NA
Molex Incorporated
1
HIFN
50000
BGA
N/A
15000
SOP8
MOLEX
700
con
MOLEX
300000
SMT
MOLEX
300000
SMT
HIFN
20000
BGA
HIFN
5000
BGA
MOLEX
6000
n/a
HIFN
146
BGA
HIFN
80000
BGA