70567-0147
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
70567-0147
MOLEX11
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
EMMICROEL
5000
TSOP-16
23+
原厂授权代理,海外优势订货渠道。可提供大量库存,详
Hirschman
56594
NA
一级代理 原装正品假一罚十价格优势长期供货
MOLEX
1070
NA
23+
专做原装正品,假一罚百!
WIRESNGLSTRD18GARDBIRRD
12000
24+
IMI
3629
SOP16W
24+
原装优势!房间现货!欢迎来电!