357-052-460-203
EDAC
亚得电子(东莞)有限公司
357 Series Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | 0.473 (12.01mm) Insulator Height
357-052-460-203
EDAC
亚得电子(东莞)有限公司
357 Series,Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | 0.473 (12.01mm) Insulator Height
EDAC
亚得电子(东莞)有限公司
357 Series Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | 0.473 (12.01mm) Insulator Height
EDAC
亚得电子(东莞)有限公司
357 Series Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | 0.473 (12.01mm) Insulator Height
EDAC
亚得电子(东莞)有限公司
357 Series Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | 0.473 (12.01mm) Insulator Height
EDAC
亚得电子(东莞)有限公司
357 Series Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | 0.473 (12.01mm) Insulator Height
EDAC
亚得电子(东莞)有限公司
357 Series Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | 0.473 (12.01mm) Insulator Height
EDAC
亚得电子(东莞)有限公司
357 Series Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | 0.473 (12.01mm) Insulator Height
EDAC
亚得电子(东莞)有限公司
357 Series Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | 0.473 (12.01mm) Insulator Height
EDAC
亚得电子(东莞)有限公司
357 Series Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | 0.473 (12.01mm) Insulator Height
EDAC
亚得电子(东莞)有限公司
357 Series Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | 0.473 (12.01mm) Insulator Height
EDAC
亚得电子(东莞)有限公司
357 Series Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | 0.473 (12.01mm) Insulator Height
MOLEX7
MOLEX莫仕公司
0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Top Contact Style20 Circuits, Lead-free, Gold (Au) Contact Plating, High Barrier Packaging
MOLEX7
MOLEX莫仕公司
0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Top Contact Style8 Circuits, Lead-free, Gold (Au) Contact Plating, High Barrier Packaging
EDAC
168
NA
22+
加我QQ或微信咨询更多详细信息,
EDAC
168
NA
22+
加我QQ或微信咨询更多详细信息,
EDAC
168
NA
22+
加我QQ或微信咨询更多详细信息,
EDAC
168
NA
22+
加我QQ或微信咨询更多详细信息,
EDAC
168
NA
22+
加我QQ或微信咨询更多详细信息,