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EDAC
亚得电子(东莞)有限公司
355 Series Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.140 (3.56mm) Row Spacing | 0.470 (11.94mm) Insulator Height
355-076-521-501
EDAC
亚得电子(东莞)有限公司
355 Series,Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.140 (3.56mm) Row Spacing | 0.470 (11.94mm) Insulator Height
MOLEX9
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-6 Multi-Port Press Fit Connector without Lightpipe Ports, EMI Metal Gasket, 240 Circuits
MOLEX9
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-2 Multi-Port Connector with 4 Lightpipe Ports, EMI Metal Gasket, 80 Circuits, Tin (Sn)/Lead(Pb) Tails
MOLEX9
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-5 Multi-Port Connector with 2 Inner Lightpipe Ports, Elastomeric Gasket, 200 Circuits, Tin (Sn)/Lead(Pb) Tails
MOLEX9
2.00mm (.079) Pitch VHDM짰 H Board-to-Board Backplane Header, Vertical, 8-Row, Signal Module, Open End Version, 200 Circuits
MOLEX9
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-2 Multi-Port Connector with 2 Outer Lightpipe Ports, EMI Metal Gasket, 80 Circuits, Tin (Sn)/Lead(Pb) Tails
MOLEX9
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-5 Multi-Port Connector with 4 Lightpipe Ports, EMI Metal Gasket, 200 Circuits, Tin (Sn) Tails
MOLEX9
VHDM짰 H-Series Board-to-Board Backplane Header, 2.00mm (.079) Pitch Vertical, 8-Row, Open Signal Module, 80 Circuits, Advance Mate Shield
MOLEX9
2.00mm (.079) Pitch VHDM짰 H Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin, Shield End Module, Open End Version, 80 Circuits, Pin Length 4.75mm(.187), Tin/Lead
MOLEX9
2.00mm (.079) Pitch VHDM짰 H Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin, Signal End Module, Open End Version, 80 Circuits, Pin Length 4.75mm(.187), Lead Free
AMLS
1000
NA/
24+
优势代理渠道,原装正品,可全系列订货开增值税票
TI(德州仪器)
7350
TO99
24+
现货供应,当天可交货!免费送样,原厂技术支持!!!
JOHNSON
8096
SMD
2016+
只做原装,假一罚十,公司可开17%增值税发票!
AMLS
80000
SOP
24+
只做自己库存 全新原装进口正品假一赔百 可开13%增
AMIS
3526
SSOP16
03+
一级代理,专注军工、汽车、医疗、工业、新能源、电力