341-076-521-207
EDAC
亚得电子(东莞)有限公司
Card Edge Connector | Green | 0.100 (2.54mm) Pitch | 0.140 (3.56mm) Row Spacing | 0.437 (11.10mm) Insulator Height
341-076-521-207
EDAC
亚得电子(东莞)有限公司
341 Series,Card Edge Connector | Green | 0.100 (2.54mm) Pitch | 0.140 (3.56mm) Row Spacing | 0.437 (11.10mm) Insulator Height
MOLEX9
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-6 Multi-Port Press Fit Connector without Lightpipe Ports, EMI Metal Gasket, 240 Circuits
MOLEX9
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-2 Multi-Port Connector with 4 Lightpipe Ports, EMI Metal Gasket, 80 Circuits, Tin (Sn)/Lead(Pb) Tails
MOLEX9
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-5 Multi-Port Connector with 2 Inner Lightpipe Ports, Elastomeric Gasket, 200 Circuits, Tin (Sn)/Lead(Pb) Tails
MOLEX9
2.00mm (.079) Pitch VHDM짰 H Board-to-Board Backplane Header, Vertical, 8-Row, Signal Module, Open End Version, 200 Circuits
MOLEX9
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-2 Multi-Port Connector with 2 Outer Lightpipe Ports, EMI Metal Gasket, 80 Circuits, Tin (Sn)/Lead(Pb) Tails
MOLEX9
Small Form-factor Pluggable Plus (SFP) Stacked 2-by-5 Multi-Port Connector with 4 Lightpipe Ports, EMI Metal Gasket, 200 Circuits, Tin (Sn) Tails
MOLEX9
VHDM짰 H-Series Board-to-Board Backplane Header, 2.00mm (.079) Pitch Vertical, 8-Row, Open Signal Module, 80 Circuits, Advance Mate Shield
MOLEX9
2.00mm (.079) Pitch VHDM짰 H Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin, Shield End Module, Open End Version, 80 Circuits, Pin Length 4.75mm(.187), Tin/Lead
MOLEX9
2.00mm (.079) Pitch VHDM짰 H Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin, Signal End Module, Open End Version, 80 Circuits, Pin Length 4.75mm(.187), Lead Free
INF有批量
367
NA/
24+
优势代理渠道,原装正品,可全系列订货开增值税票
INFINEO
80000
SOP8
24+
只做自己库存 全新原装进口正品假一赔百 可开13%增
CDE
19960
原厂原包
23+
只做进口原装 终端工厂免费送样
恩XP
12500
SOT502
18+
全新原装正品,本司专业配单,大单小单都配
AMPHENOL/安费诺
11563
24+
原厂现货渠道