MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76關m (30關) Gold, (Au) Selective Plating
MOLEX11
MOLEX莫仕公司
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76關m (30關) Gold, (Au) Selective Plating
MOLEX11
MOLEX莫仕公司
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
SMARTMODULARTECHNOLOGIES
189
67000
N/A
23+
一级代理放心采购
94000
N/A
23+
一级代理放心采购
ST原装
20425
TO-220
22+23+
绝对原装正品全新进口深圳现货
ST/意法
32500
TO-220
22+
郑重承诺只做原装进口货