15-80-0207

MOLEX2

2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating

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15-80-0207

MOLEX11

2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,

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15-80-0209

MOLEX11

2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing

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