MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
158-9020
GE
11700
DIP-6
24+
ADI/亚德诺
66900
22+
原封装
TE CONNECTIVITY
880000
SMD
23+
明嘉莱只做原装正品现货
TE/泰科
473077
/
2508+
一级代理,原装现货
15891TS
61724
61724