BUSSMANN/巴斯曼
5000
标准封装
BUSSMANN
1000
MODULE
CREDENCE
54815
BGA
荣湃半导体
59
NB SOIC-16
ST
16900
VDFN
TOSHIBA/东芝
69820
TO-252
ST
16900
VDFN
TW
88888
TO220S
72000
N/A
64000
N/A
ST
16900
VDFN
2PAI SEMI/荣湃
12500
WB SOIC-16
KEC
6000
TO-220
WECOELECTRICALCONNECTORS
12730
NA
WECO
100500
SMD