Key Features
• Material: Copper
• Wick Structure: Powder Sintered Copper
• Light Weight
• Versatile with high thermal performance
ADI(亚德诺)
18798
N/A
ADI(亚德诺)
18746
N/A
ADI/亚德诺
33680
EvaluationBoard
N/A
12300
TE CONNECTIVITY美国泰科
9850
NA
TE
3990
12480
10
10
DD
429
124
WEIDMULLER
20
TE/泰科
360000
NA
DD
429
124
TE/泰科
275591
/
TE
100
Keystone Electronics
44
原厂封装
THAT
6328
SOIC-8