Features
For surface mounted applications in order to optimize board space
Low profile package
Built in strain relief
Glass p assivated j unction
Low inductance
Excellent clamping capability
1000W peak pulse power capability at 10/1000 μ s waveform,
r
epetition r ate (duty cycle): 0.01%
Fast response time
Typical I R less than 1 μ A above 12V
High Temperature soldering: 260℃/10 seconds at terminals
Plastic package has underwriters laboratory flammability 94V 0
Meets MSL level 1, per J STD 020
IEC61000 4 2 ESD 30KV Air, 30KV contact compliance
Applications
I/O interface
AC/DC power supply
Low frequency signal transmission line (RS232, RS485, etc.)
JST
10750
JST
82610
connector
JST
82610
2019+
JST/日压
275591
/
RUBYCON
51800
JST
300000
SMT
SANYO-三洋
96800
车规-电解电容
SUNMATE
18800
DO-201
JST-日压
12680
车规-连接器-
VISHAY/威世
50000
DO-201AD
MIC
3000
R-6
Rubycon
9652
DIP-2
SANYO/三洋
100
DIP
DIODES/美台
43600
TO-277
orig
110
R-6