Features

■ For surface mounted applications in order to optimize board space

■ Low profile package

■ Built-in strain relief

■ Glass passivated junction

■ Low inductance

■ Excellent clamping capability

■ 1000W peak pulse power capability at 10/1000μs waveform,

repetition rate (duty cycle): 0.01%

■ Fast response time

■ Typical IR less than 1μA above 12V

■ High Temperature soldering: 260℃/10 seconds at terminals

■ Plastic package has underwriters laboratory flammability 94V-0

■ Meets MSL level 1, per J-STD-020

■ IEC61000-4-2 ESD 30KV Air, 30KV contact compliance

Applications

■ I/O interface ■ AC/DC power supply

■ Low frequency signal transmission line (RS232, RS485, etc.)