001591-0527
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
MOLEX2
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 10 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
MOLEX7
0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Top Contact Style, 4 Circuits, Lead-free, Gold (Au) Contact Plating, High Barrier Packaging
MOLEX7
0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Top Contact Style6 Circuits, Lead-free, Gold (Au) Contact Plating, High Barrier Packaging
MOLEX7
0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Top Contact Style7 Circuits, Lead-free, Gold (Au) Contact Plating, High Barrier Packaging
MOLEX7
0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Top Contact Style8 Circuits, Lead-free, Gold (Au) Contact Plating, High Barrier Packaging
MOLEX7
0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Top Contact StyleCircuits, Lead-free, Gold (Au) Contact Plating, High Barrier Packaging
NISSEI/日精
106480
SMD
07+ROHS
NISSEI
65386
1206
25+23+
绝对原装正品现货,全新深圳原装进口现货
800
24+
TE/泰科
337362
/
2508+
一级代理,原装现货
ALLIED TITANIUM
2
25+
公司优势库存 热卖中!