SDA-70204-0272
MOLEX3
美国莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 34 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
MOLEX3
美国莫仕公司
2.54mm (.100) Pitch C-Grid Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 8 Circuits
MOLEX3
美国莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 10 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
MOLEX3
美国莫仕公司
2.54mm (.100) Pitch C-Grid Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 12 Circuits
MOLEX3
美国莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 14 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
MOLEX3
美国莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 20 Circuits, 0.38關m (15u) Gold (Au) Selective Plating
MOLEX3
美国莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 22 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
MOLEX3
美国莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 24 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
MOLEX3
美国莫仕公司
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 26 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
SIEMENS
50000
DIP8
2024+
原装现货
BB
50000
DIP8
2024+
原装现货
SIEMENS
50000
DIP8
2024+
原装现货
SIEMENS
50000
DIP8
2024+
原装现货
ST
8000
uQFN-2
23+
只做原装现货